Staff/Snr Engineer, Microelectronic Assembly

The role requires the candidate to design and implements die attach and wirebond processes for New Product Introduction (NPI) solution for microwave/mmwave IC packaging for high frequency applications. The candidate will review and enhance existing packaging processes to improve yield and productivity. He/she shall work with internal resources and packaging suppliers to achieve functional packaging goals.

• Be the subject matter expert of MEDs microelectronic assembly team and advise Design Engineering early in new product development to ensure designs are manufacturable.
• Operate and supervise, including setup, die attachment and wirebonding equipment for all microelectronics assembly processes.
• Responsible to develop, design, and test standards and guidelines for developing microelectronics packaging solutions for MEDs customer products in aerospace and defense applications.
• Responsible to define, develop and qualify new p...