Staff Process Engineer - Die Attach / Clip Attach

Job Description

The Die Attach /Clip Attach (Solder) Engineer owns, develops, and sustains the solder die attach & clip attach process to achieve stable yields, high equipment uptime, and full compliance with reliability and customer requirements. The role demands wide semiconductor manufacturing experience across high‑mix assembly, rigorous process controls, and data‑driven problem solving to support both NPI ramp and high‑volume manufacturing.

Responsibilities

• Process ownership & control: define, sustain, and optimize key die attach parameters and tooling effectiveness; establish and maintain the recipe management system, process/set‑up controls, process capability, and process performance (Ppk); generate and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), and reaction plans (OCAP).
• Yield & quality improvement: lead problem‑solving using the 8‑discipline approach for internal and external issues such as cu...