Staff Engineer — Microelectronic Packaging & NPI

MEDS TECHNOLOGIES PTE LTD in Singapore seeks a skilled candidate to design and implement die attach and wirebond processes for high frequency microelectronics packaging. The ideal applicant will enhance existing processes, manage equipment, and support product life cycles.

A Master’s degree or equivalent in electronic field and 5-7 years experience in microelectronics assembly is required, along with proficiency in assembly workflows and CAD software. This is an exciting opportunity to work with cutting-edge technologies in aerospace and defense.