Senior Wafer Bonding Engineer, Advanced Packaging R&D

A*STAR - Agency for Science, Technology and Research in Singapore is seeking a Research Senior Engineer to advance wafer-to-wafer bonding and related semiconductor packaging technologies. You will conduct hands-on process development, wafer characterization, and collaborate across design, integration, materials, and equipment teams to enable next‑generation packaging solutions.

The role focuses on developing and optimizing bonding processes (hybrid and temporary bonding), performing DOE studies,