Senior Technologist, Hybrid Bonding Module
I
Intel
📍 Hillsboro, OR, United States
Job Description
**Job Details:**
**Job Description:**
**The Role and Impact**
As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
**Key Responsibilities**
+ Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, eq...
**Job Description:**
**The Role and Impact**
As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
**Key Responsibilities**
+ Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, eq...