Senior Packaging Engineer: Thermal Design & CFD

Sandisk in Batu Kawan, Penang is seeking a Packaging Engineer to join their R&D group. You'll handle thermal designs across semiconductor packaging, focusing on solutions that meet demands for small form factor packages.

The ideal candidate should possess a B.S. in Mechanical Engineering with at least 5 years of experience and proficiency in CAD software (SolidWorks, AutoCAD). Strong communication skills and a solid work ethic are essential.