Senior Manager, High-Volume Semiconductor Packaging

Renesas Electronics Corporation in Ipoh, Malaysia, seeks an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to drive sustaining engineering and high‑volume manufacturing for advanced packaging technologies, including power packaging and SiC/GaN. You will partner with Package Engineering, R&D, Quality, and OSATs to translate development intent into scalable production.

The role emphasizes yield and process control, data‑driven problem solving, and cross‑functional