Senior Die Bond/Wire Bond Engineer — Process & Yield

Nexperia is seeking an engineer responsible for end-to-end ownership of process and equipment performance in Die Bond and Wire Bond stations. This position requires strong technical capabilities and collaboration with cross-functional teams to ensure high equipment uptime and quality excellence.

The ideal candidate should have a bachelor's degree in engineering and 5-7 years of hands-on experience in semiconductor manufacturing. Responsibilities include managing tooling setup and daily support to production lines, as well as leading new product introductions.