Senior Advanced Packaging Architect for HPC/AI Chips

Bitdeer is seeking a Staff/Principal Advanced Packaging Engineer to lead packaging architecture, technology strategy, and high‑volume manufacturing for next‑gen HPC/AI silicon. This high‑impact role defines the packaging roadmap, leads chip–package–board co‑design, and ensures scalable production for large‑die devices.

You will drive SI/PI, thermal, and mechanical reliability, manage external packaging partners, and shepherd NPI from concept through mass production with a strong focus on