Power & RF Packaging Simulation Engineer — Hybrid & Flexible

Tampere University invites a Design, Simulation and Modelling Engineer to lead modelling processes for semiconductor packaging at SiPFAB on Hervanta campus. You will develop design, simulation, and methods, collaborating with academia, research institutes and industry to demonstrate and mature advanced packaging technologies.

You will define software tools, explore AI-driven design, and enable robust, scalable design processes, while training new users and working with vendors to advance