Job Description
Package Design Engineer
_corporate_fare_ Google _place_ Sunnyvale, CA, USA
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
**Minimum qualifications:**
+ Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
+ 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
+ Experience in chip package substrate layout, design verification, DFM and taping out for production.
+ Experience in design automation and scripting.
**Preferred qualifications:**
+ Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
+ Experience in working with cross functional teams including chip design, SI/PI, and PCB design teams.
+...
_corporate_fare_ Google _place_ Sunnyvale, CA, USA
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
**Minimum qualifications:**
+ Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
+ 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
+ Experience in chip package substrate layout, design verification, DFM and taping out for production.
+ Experience in design automation and scripting.
**Preferred qualifications:**
+ Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
+ Experience in working with cross functional teams including chip design, SI/PI, and PCB design teams.
+...