Package, Assembly, Test (PAT) Team Lead

• We are seekinganexperienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leaderwith degree in Electrical Engineering, Photonics,Mechanical Engineer,or a related field.

What you'll do

• Lead Asia operation team working with OSATs, assembly houses, PCBA lines to support NPI and volume production.
• Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies.
• Working with HQ team to support device packaging process improvement with Cp and Cpk increase.
• Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and after burnin.
• Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production.
• Work with reliability engineers to implement the tests needed f...