Lead Test Architect – Advanced Packaging

Job Description

Microchip’s Advanced Packaging team delivers competitive advantage by enabling the next generation of highly integrated, miniaturised electronic solutions. By combining expertise across materials, mechanical, electronics and packaging disciplines, the team pushes the boundaries of what is possible in modern microelectronics.

As a Principal Test Engineer, you will play a critical role in the design, development and industrialisation of next‑generation electronic modules. You will shape test strategy, drive technical direction, and collaborate across a multi-disciplinary environment to deliver robust, scalable and high‑performance solutions.

We are seeking a technically curious and forward‑thinking engineer who thrives in solving complex challenges and influencing innovative product development.

Key Responsibilities

• Define and lead test strategies to enable efficient, high‑quality product verification and valid...