Job Description
The Role and Impact
As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
Key Responsibilities
• Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equi...