Die & Wire Bond Process Engineer – High-Volume NPI

Nexperia in Seremban, Malaysia is seeking a skilled engineer responsible for the Die Bond and Wire Bond processes in a high-volume semiconductor assembly line. The ideal candidate will have a Bachelor’s degree and 2-3 years of relevant experience, ensuring equipment performance and process stability.

You will manage tooling setups, conduct root cause analyses, and lead new product introductions among various responsibilities. Strong analytical and collaboration skills are essential, along with a commitment to continuous improvement.