Die Bond & Wire Bond Process Engineer II

Nexperia in Malaysia is looking for an engineer responsible for the Die Bond and Wire Bond processes in a semiconductor assembly line. You will own process and equipment performance, and ensure high equipment uptime and quality in a high-volume manufacturing environment.

The ideal candidate has a Bachelor's degree in engineering and 2–3 years of relevant experience. Key responsibilities include managing tooling, conducting analyses, and collaborating across teams to ensure process reliability.