Design, Simulation and Modelling Engineer for Advanced Semiconductor Packaging (SiPFAB) / Malli[...]

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities’ community has its competitive edge in technology, health and society.

SiPFAB is a new infrastructure being established at the Faculty of Information Technology and Communication Sciences of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions.

SiPFAB enables the development and experimentation of future‑oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot‑scale development of emerging chip technologies that drive energy‑efficient solutions for industrial applications in transportation and energy sy...