Assembly Process Engineering Manager – Semiconductor Packaging

Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Employment Type: Full-Time
Experience: 12 18 Years
Industry: Semiconductor / ATMP / OSAT / IC Packaging

We are looking for an Assembly Process Engineering Manager to lead semiconductor packaging-process engineering in a high-volume ATMP/OSAT manufacturing environment. The role will own process development, qualification, production ramp-up, process stability, yield improvement and engineering-team performance.

The position requires hands-on expertise in die preparation, die attach, wire bonding, molding, marking and package singulation, along with proven experience leading cross-functional engineering programs.

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