ASIC Packaging Engineer – High-Speed SerDes & SI/PI

Link-Worldwide is looking for a professional to design complex flip-chip-BGA packages tailored for high-speed SerDes and high-power delivery applications. This role requires collaboration with a global R&D team to develop cutting-edge package designs for ASICs utilized in AI, networking, HPC, and 5G base stations.

The ideal candidate will analyze chip requirements to determine the necessary package type and manage critical design tasks focused on signal and power integrity.